WebMCP6489-E/ST is an operational amplifier with EMI filtering. It operates with a single-supply voltage, as low as 1.8V while drawing low-quiescent current (720µA, maximum per amplifier). This op amp also has low-input offset voltage (±1.6mV, maximum) and rail-to-rail input and output operation. In addition, MCP6489-E/ST is unity gain stable and has a gain … WebLand pattern dimensions for reference only (mm) Packing Method: Embossed Tape: Packing Name: EL: Minimum Quantity: 1000 pcs/Reel: Tape Width (mm) 24: Tape Dimensions …
SOT505-2 Table 1. Package summary - Nexperia
WebThe Thin Small Outline Package, or TSOP, is a rectangular IC package with a thickness of 1.0 mm. There are two types of TSOP's. The Type I TSOP has its leads protruding from the … WebMM74HCT00MTCX TSSOP−14 WB, Case 948G (Pb−Free and Halide Free) 2500 Units / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. NOTE: All packages are lead free per JEDEC: J−STD−020B standard. thumbnail meaning in tamil
TSSOP: Thin Shrink Small Outline Package MADPCB
WebSOP MSOP TSSOP SOT23 (8 10 14 16 20 24 28) SMT DIP Adapter Plate ; 35 pieces of double-sided prototype plates in 7 different sizes to meet your needs. Pre-tinned plated holes on the board make it very convenient to solder components and sensors for your projects. › See more product details WebExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are leadframe based, plastic encapsulated packages that are well suited for applications requiring optimum thermal performance, compressed body size and tightened lead … The Thin shrink small outline package has a smaller body and smaller lead pitch than the standard SOIC package. It is also smaller and thinner than a TSOP with the same lead count. Body widths are 3.0 mm, 4.4 mm and 6.1 mm. The lead counts range from 8 to 80 pins. The lead pitches are 0.5 or 0.65 mm. See more The Thin Shrink Small Outline Package (TSSOP) is a rectangular surface mount plastic integrated circuit (IC) package with gull-wing leads. See more They are suited for applications requiring 1 mm or less mounted height and are commonly used in analog and operation amplifiers, controllers and Drivers, Logic, Memory, and RF/Wireless, Disk drives, video/audio and consumer electronics. See more • List of integrated circuit packaging types • Small outline integrated circuit See more • Soldering a TSSOP chip by hand See more Some TSSOP packages have an exposed pad. This is a rectangular metal pad on the bottom side of the package. The exposed pad will … See more • Shrink Small Outline Package • Mini Small Outline Package • Small outline integrated circuit See more thumbnail maker without watermark download